Engineer, HIG-HBM Product Engineering (Media Health Manufacturing)

Responsibilities:

• Optimized Test Coverage: The responsibility of ensuring optimized test coverage on all current and future HIG HBM design architectures and process nodes is a technical aspect of this role. This is crucial for maintaining the effectiveness and efficiency in high-volume manufacturing.
• Product Development and Validation: This role is pivotal in developing, validating, characterizing, and qualifying Micron’s next-generation HBM products. Ensuring that these products are reliable and meet the necessary standards is a technical task that directly impacts the market readiness of the products.
• Support for New Product Design Validation: The role provides support for design verification and in-depth circuit of new products using CAD tools and Verilog simulations. This technical support is crucial for the development of new products and technologies.
• Yield Improvement and Cost Reduction: The role involves technical tasks like improving manufacturing test yields (Specifically related to Device Issues from the DRAM, Interface and Stacked Die Yield), reducing test time, and resolving yield-related issues. These activities are critical for cost reduction and meeting yield targets.
• Root Cause and Resolution of Manufacturing Test Flow Issue, Qual and RMA Device Issues
• Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market.
• Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.
• Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.
• Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.
• Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

Requirements

• Bachelors/Masters in Electrical and Electronics Engineering Degree or related field.
• Demonstrating Strong Leadership Skills and Technical Skills, especially in problem solving with root cause understanding and solution space through in depth circuit analysis.
• Basic understanding of CMOS technology and DRAM device physics and design.
• Good knowledge of statistics and data analysis tools and scripting.
• Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).
• Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.
• Strong sense of responsibility and accountability towards assigned role with professional work ethic.
• Effective communication skills in written and spoken English to articulate technical concepts and findings.