Your responsibilities will include, but are not limited to, the following:
- Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability.
- Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability.
- Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners.
- Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility.
- Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams.
- Assist in the transfer of new technology from R&D to manufacturing. Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing.
Successful candidates for this position will have:
- Must have:
- Passionate about semiconductor technology and innovation.
- Adept at data analysis, problem-solving, and process integration optimization.
- Excellent communication skills and ability to work in cross-functional teams.
- Preferred to have Skills / Experiences as below:
- Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable.
- Minimum of 3 years of experience in the semiconductor industry in the areas of Process Integration and Yield Enhancement.
- Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms.
- In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.
- Exposure to R&D and transfer/manufacturing is desirable.
- Committed to quality, collaboration, and continuous improvement.
- Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment.
- Extended travel to the US spanning several months to a year will be a requirement for the role.
Education:
BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field.