Principal/ Senior/ Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA)

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.

We are currently experiencing a transformative period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.

We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team!

Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new metrology and RDA technologies for solutions that drive the future. Additional responsibilities include establishing equipment evaluation and long-range strategy to enable advanced packaging technology roadmap.

Key responsibilities and duties include:

Recipe Development and Optimization:

• Develop and optimize metrology recipes for various semiconductor processes
• Ensure that the recipes are accurate and efficient for production needs
• Develop and execute strategies for process monitoring, sampling, and continuous improvement (CIP)

Inspection and Characterization:

• Establish inspection methodologies and best-known methods (BKM) for metrology processes
• Perform in-line characterization and validation of metrology recipes

Data Analysis and Reporting:

• Utilize data analysis tools like Power BI to summarize and report on metrology recipe status and project progress
• Continuously analyze data to identify improvement opportunities and ensure process efficiency

Quality and Performance Indicators:

• Own and manage metrology tools, ensuring they meet performance indicators and quality standards
• Drive the defense line readiness and set up control plans, OCAP (Out of Control Action Plans), and SPC (Statistical Process Control) charts

Collaboration and Coordination:

• Engage in early involvement with Advanced Packaging Technology Development (APTD) to ensure seamless integration of new technologies
• Work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control

Requirements

• B.S/M.S./Ph.D. (or equivalent education) in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, or other related technical fields
• 2 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field
• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability
• Hands on experience with wafer/assembly tools or metrology/RDA systems
• Tenacity to work effectively under timelines and limited resources
• Consistent track record to solve problems and address root causes