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Senior Mechanical Engineer

ASMPT SINGAPORE PTE. LTD.

Open D27 Yishun, Sembawang $8,000.00 - $11,000.00

Posted: May 16, 2025

Job Description

Overview:

We are seeking Senior Mechanical Design Engineers to join our team in developing high-precision mechanical modules for advanced packaging equipment in the semiconductor industry. This role involves end-to-end mechanical design—from concept generation to detailed analysis—and collaboration with cross-functional teams to enhance system performance, manufacturability, and reliability.

Key Responsibilities:

  • Analyze customer and product requirements, and translate them into mechanical specifications and technical design solutions.
  • Develop, model, and validate design concepts using tools such as force analysis, thermal and vibration simulation, and lifetime estimation techniques.
  • Select efficient and cost-effective design solutions, factoring in performance, reliability, and manufacturability.
  • Perform material selection to ensure mechanical durability and process compatibility.
  • Design precision tooling, jigs, and fixtures to support high-yield and high-accuracy packaging operations.
  • Create and manage 3D models, detailed engineering drawings, and perform structural analysis.
  • Collaborate with Manufacturing, Process, and Quality Engineers to ensure seamless integration and Design for Manufacturability (DFM).
  • Drive continuous improvement initiatives in design methodologies, tooling, and product robustness.
  • Ensure all mechanical designs comply with internal quality standards and external regulations, including Singapore’s workplace safety and environmental requirements.

Job Requirements:

  • Degree or higher qualification in Mechanical Engineering or a related discipline from a recognized institution.
  • Prior experience in mechanical design, preferably within semiconductor or high-precision equipment industries.
  • Proficient in one or more CAD tools such as Solid Edge, SolidWorks, Pro-E, or AutoCAD.
  • Knowledge of advanced packaging processes (e.g., wafer-level packaging, 2.5D/3D integration, flip-chip assembly) is advantageous.
  • Familiarity with thermal control, vibration isolation, and high-precision motion system design is a plus.
  • Strong analytical and problem-solving skills with the ability to work independently and manage priorities in a dynamic environment.
  • Excellent communication and teamwork abilities.

How to Apply

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