Advanced Packaging Characterization Engineering

As Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD) your responsibilities include but are not limited to providing package development characterization and failure analysis support for qualifications, customer returns, new product introduction, and general test failures. You will become the domain expert on advanced packaging characterization methodology and be responsible for understanding relevant analysis methods to improve and develop processes related to assembly and test processes. You will also have a thorough understanding of the product package assembly and process flow, to work with Process Integration, Process Development, and Product Engineering groups ensuring failures are classified and root cause fixes implemented.

Responsibilities and Tasks

Conduct Electrical Characterization

• Understand PFA techniques available for de-processing failures
• Understand assembly and test process
• Perform electrical verification to confirm failures
• Understand and recommend best known method for de-processing package

Provide Data Analysis

• Understand backend test flows, qualification methodologies and be able to pull relevant information

Communicate with Internal/External Groups

• Document failure analysis techniques used to isolate failure for other groups
• Quick and responsive analysis and feedback of PFA results to Product, Process Integration, Reliability, Assembly, RMA, and QRA
• Ensure the PFA lab understands best method PFA to obtain results and ensure lab is ready for analysis on new designs
• Co-ordinate RMA pertaining to Test and Assembly related problem
• To establish contacts with QRA on RMA issues

Provide Technical Expertise

• Conduct TMO training and FA certification

Maintain Equipment

• Coordinate calibrations (external to Micron)
• Procure parts as needed
• Coordinate host vendors to support equipment repair

Manage Laboratory

• Manage laboratory to comply with TS, ISO14001 and OHSAS requirements.
• To manage the exhaust and scrubber systems of the FA Lab.
• To maintain records and procedures as per Micron GOPs

Education and Experience

• PhD/Master/Degree holder in Electrical/Electronics Engineering or Applied Science with major in Physics/Chemistry/Material Science or related field
• Expeerience in R&D or Technology Development
• 2+ year of experience in semiconductor or failure analysis field. Good knowledge on failure analysis methodology
• The following experience/knowledge is must: SEM, EDX, FIB, TEM, AFM, FTIR, XPS, XRAY, CSAM, Ion Miller, delayering and decapsulation techniques
• Good communication skills with internal and external group of personnel
• Strive for excellence and focus on the customer mindset and behavior
• Experienced in Semiconductor or PCBA manufacturing process

Keen on the role? Apply now!