Dry Etch Staff/Principal Engineer - Advanced NAND

As a Staff/Principal Engineer, you will be a part of revolutionary Next Generation NAND research & development Dry Etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with Next Generation NAND. You will work directly with process integration and other process areas such as Wet Etch, CVD, Diffusion, Metals, Lithography & CMP. You will work on state of the art and best in class dry etch chambers & own the process roadmap to meet program and yield goals. Your responsibilities include, but not limited to: 

Leading Dry Etch unit process and critical module development

• Develop/innovate dry etch processes to meet structural and electrical specifications

• Collaborate and lead cross functional teams to solve complex structural problems

• Present process and technology roadmaps for current and future technology nodes

• Associated with critical modules such as HAR, Tier by tier etches, WL contacts & staircase

Interaction with other Process Areas

• Identify opportunities & drive towards a collaborative solution

• Guide other areas technology roadmaps

• Lead or be a part of cross functional task force groups driving towards a target

• Develop basic knowledge tending to expertise in other areas process hardware, or technologies

Interaction with Dry Etch peers

• Be a resource and mentor for peers in dry etch technology and/or project management

• Provide critical updates to upper management on project status and impacts

Successful candidates for this position will have:

• Demonstrated aptitude for a research and development environment

• 3-10 years’ experience in dry etch process development in R&D transferring to manufacturing

• 2-3 years of relevant NAND, DRAM or Logic module development experience, e.g.: cross-functional teams projects and deliveries

• Knowledge of plasma physics, plasma chemistry, transport or surface phenomena gained through experience and/or coursework

• Demonstrated leadership in problem solving. Experience in managing technical projects

• Understanding various types of plasma dry etch reactors (e.g., RF sources, chemistries)

• Expertise in statistical process control and analysis

• Experience in solving scalability problems of deep high aspect ratio silicon/dielectric etches with a fundamental understanding of advanced conventional and unconventional (tailored) pulsing schemes

• Demonstrated ability to lead supplier head to heads

• Data science basics / Python coding / AI coders shall be preferred over candidates without this experience

• Strong computer skills, including MS Office, and SAS software like JmP and similar

Education

• Masters / PhD (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical physics, Chemistry, Semiconductor engineering or relevant majors) with 4-10 years of relevant dry etch process development experience

• Bachelors (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical physics, Chemistry, Semiconductor engineering or relevant majors) with 7-12 years of relevant experience