Engineer, Advanced Packaging Equipment Engineering

Job Description

Responsibilities

Equipment Development:
• Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking
• Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity

Equipment Tactics:
• Evaluate and promote new equipment and materials to enhance process capabilities
• Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron’s products. cost, availability, and improve hardware and process capability

Quality Improvement:
• Ensure defense coverage through process, measurement, inspection, and testing
• Establish correlations between defense mechanisms to identify improvement opportunities
• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities

Collaboration and Coordination:
• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives
• Work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
• Ensure smooth transition from new product development, qualification, small volume production to high volume production

Requirements

• B.S/M.S./Ph.D. (or equivalent education) in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or other related technical fields
• Experience in semiconductor process or equipment engineering experience would be beneficial
• Experience in equipment development with fundamental understanding to execute to improve equipment maturity for First of a Kind (FOAK) hardware would be beneficial
• Tenacity to work effectively under timelines and limited resources
• Consistent track record to solve problems and address root causes

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.