Principal Engineer, Advanced Packaging Technology Development Metro Real-time Defect Analysis

Department Intro:

The Technology Development (TD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products. By collaborating closely with our global R&D and manufacturing teams, we ensure the efficient transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Join us to be part of a dynamic and forward-thinking team that is molding the future of technology!

Position Overview:

As a Metro/RDA Principal Lead Engineer in the APTD team, you will be primarily responsible for leading a team to develop RDA and Metro roadmaps and recipe solutions to enable product quality and reliability for next generation HBM. You will also be responsible for defining and driving system solutions to improve traceability of issues to enable development.

At Micron, we value People, Innovation, Tenacity, Collaboration and Customer Focus. Ideal Candidates will seek to use those values to guide their work. We tackle challenging tactical and technical problems to meet the demands of our fast-paced and dynamic development environment. You will be working in a highly collaborative atmosphere, interacting with various groups to ensure robust solutions that meet the detailed physical and electrical requirements for Micron products. You will grow into an expert engineer, driving roadmaps, which have a direct influence on Micron’s global leadership in semiconductor manufacturing.

Job Description

Responsibilities:

· Lead a team to develop methods for defect identification and monitoring

· Define ownership and priorities amongst the team

· Enable proper training and development of new engineers

· Understanding of available methods and tools sets

· Ability to establish a yield pareto and raise awareness of current process anomalies

· Guide team to develop roadmaps to address gaps in current defect detection capabilities

· Define system solutions requirement to improve traceability of defects to improve line yields and drive enablement with IT, Probe, Process and Integration teams

· Work directly with OEMs to define tooling and application roadmaps for next generation HBM

· Enable shift-left preventative techniques to identify risk failures early in product lifecycle

· Responsible for Yield pareto

· Identify, and raise awareness of process anomalies

· Build and improve upon techniques and identify new ways to use existing tools to quantify relevant process issues

Qualifications:

· Proven ability to lead RDA and/or technology development teams

· Demonstrated ability to drive network wide RDA roadmaps

· Strong knowledge of Advanced Packaging RDA and/or Metrology best known methods to guide development

· Ability to work with suppliers to define roadmaps

·  Demonstrated ability for innovation through patents or other similar awards

Education:

· PhD w/ 8 years relevant experience

· Masters w/ 10 years relevant experience

· Bachelor’s w/ 12 years relevant experience

· Or 16 years relevant experience in Real-Time Defects Analysis