Principal Lead/Engineer, Process Dev, CMP

Micron’s NAND Process Development (PD) Singapore group is looking for process development engineer lead to support TD activities associated with rapid deployment of technology nodes, the process development work necessitated thereof as well as to ensure extended engagement with manufacturing on the upcoming technology nodes.

Responsibilities

• Lead PD_SG CMP team for program level deliverables (Process capacity improvement, Yield enhancement, MOR-POR gap closure, CT improvement, Cost reduction)
• Conduct performance management and professional development of the direct reports.
• Partnering with Equipment, IE Planning, Facilities and Vendors to buy and install new equipment.
• Manage, measure and monitor projects to ensure deliverables and time frames are met.
• Working with process development engineers in Boise, US TD site and vendors to develop processes that meet integration requirements for next generation vNAND nodes.
• Lead the team and transfer CMP processes to high volume manufacturing (Fab10), and work on continuous improvements to manufacturability.
• Address process issues working with Fab10 team and with key business partners on tool choices for manufacturing, evaluations etc., as applicable.
• Focus on understanding and improving the process margins required for meeting the mature yield goal for vNAND parts.
• Advanced vNAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications.
• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions
• Identify process simplification opportunities and drive cross functional teams in implementation
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.
• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction.
• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.
• This position requires communications and collaboration with partners both locally and globally.  Strict adherence to Micron Intellectual Property Protection policy is a must.
• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.

Requirements

• Bachelor’s degree or higher in Materials Science, Chemical Engineering or Physics with minimum 5 years hands-on experience in leading edge CMP polishing equipment. Manager and Lead working experiences are preferred.
• Lead and mentor CMP junior engineers while driving technical excellence.
• Build, lead, grow a capable CMP team for NAND technology development.
• Master in CMP equipment operation, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads.
• Excellent problem-solving skills and critical decision making.
• In-depth understanding of polishing mechanisms for dielectric and metal CMP.
• Understanding of various integration and structural impacts and constraints related to film deposition processes.
• An understanding of the general process steps and process flow for memory processing, planar and vNAND memory.
• Proven ability to collaborate with local and overseas teams on projects
• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required
• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously
• Ability to travel for extended periods of time and stay at Boise TD for 4-6 months at a stretch to work on technology development.