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Senior Manager

STATS CHIPPAC PTE. LTD.

Open D27 Yishun, Sembawang $10,000.00 - $16,000.00

Posted: August 15, 2025

This job listing is sourced from MyCareersFuture.gov.sg, Singapore's official government job portal.

Job Description

Purpose of the Job :

  • In-charge, lead & drive NPI (new product development – design > material selection > qualification > high volume manufacturing) group and assembly process engrg (all the process).
  • To lead and drive new package qualification (from design stage to high volume and sustain quality & yield).
  • To lead and drive process engrg (covering all process).
  • Sustain and provide continuous improvement yield/ quality /productivity through planning, evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements
  • Daily quality review/monitoring of yield and drive defect root cause analysis.
  • Understand systematic problem solving methodology and used of ESDA/FMEA/SPC/DOE/MSA etc.
  • To provide interim containment/disposition and long-term corrective actions for any excursions.
  • To make a characterization plan and risk assessment for new and existing device requiring engineering support.
  • To drive yield and quality improvement.
  • To drive productivity and cost improvement thru uph, material qualification and process simplification.
  • Involve/support all assembly process issues.
  • Responsible for guiding NPI & Process engineers in resolving yield and quality issues.
  • To lead / coach engineers in driving yield, quality and productivity.
  • Customer interface – handling NPI / engrg activities / quality performance mtgs / manage issues.
  • Work with TPM / Customer for new NPI design win opportunities.
  • To lead & drive material cost reduction programs, through value engrg programs.
  • Able to cohesively co-work with all supporting groups & operations team.

Required Experience and Qualifications:

  • Degree in E&E Engineering or its equivalent.
  • Minimum 10 years of experience in NPI Development, Assembly Process Engineering, in a multinational or OSAT industry.
  • In depth know how of BGA/Leadframe processes and packages.
  • In depth know how of assembly materials and its interaction to package workmanship and reliability.
  • In depth know-how of DOE/SPC/FMEA/MSA/JMP and other problem solving methodology tools.
  • Knowledgeable in APQP standards and Automotive standard.
  • Knowledgeable on wirebond assembly process equipments & mfg.

How to Apply

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